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一 |     8月26日消息,苹果推出新款Mac mini与Mac Studio,最高分别搭载2nm芯片M6及M5 Ultra芯片,在性能和AI能力上实现了颠覆性跃升。

二 |     At the invitation of Chinese President Xi Jinping, King of the Hashemite Kingdom of Jordan Abdullah II ibn Al Hussein will pay a state visit to China from August 18 to 24, according to Chinese Foreign Ministry on Monday.    This visit marks King Abdullah II's ninth visit to China since his accession to the throne, said foreign ministry spokesperson Lin Jian at a regular press briefing on the same day.    Lin said that during the visit, President Xi will hold talks with King Abdullah II, exchanging their opinions on bilateral relations and international and regional issues of mutual interest. Premier Li Qiang and Chairman of the Standing Committee of the National People's Congress Zhao Leji will meet with him respectively, Lin added.    King Abdullah II will also visit Shanghai and Shenzhen, Lin said.    Noting China and Jordan enjoy traditional friendship, Lin said under the strategic guidance of President Xi and King Abdullah II, China-Jordan relations have maintained steady growth in recent years, with fruitful cooperation across many fields and deepening friendly exchanges between the two countries.    China will work with Jordan to take this visit as an opportunity to jointly enhance political mutual trust, expand mutually beneficial cooperation, promote people-to-people exchanges and deepen collaboration on multilateral occasions, to take the bilateral strategic partnership to a new height and make positive contributions to regional peace, stability, and development, said the spokesperson.                    。    

    M6是苹果首款采用2nm制程的芯片,所有计算模块均获得全面升级。

三 | 其配备12核中央处理器,包含2颗超级核心、4颗性能核心和6颗能效核心,三种核心均具备业界领先的性能功耗比。    单线程性能全面领跑,多线程性能较M5提升最高达1.2倍,较M1提升最高达2.4倍。

四 |     

    AI算力方面,M6搭载双16核神经网络引擎,峰值计算性能较前代提升最多达2倍。

五 | 统一内存最大可达32GB,带宽高达170GB/s,较M5提升10%,较M1提升2.5倍。    GPU升级为12核(每颗核心内置神经网络加速器),AI峰值计算性能较M5提升近30%,较M1提升超过8倍。

六 |     此外,M6还集成了苹果最新的图形能力,包括更新的着色器核心架构、动态缓存和硬件加速光线追踪技术。相比M5,M6多出2颗中央处理器核心和2颗图形处理器核心,加之神经网络引擎与内存带宽的改进,能更高效地应对各类工作负载。    M5 Ultra是苹果迄今为止最强大的芯片,专为专业人士打造。

七 | 苹果首次在M系列自研芯片中采用UltraFusion封装技术,将两枚双晶粒M5 Max芯片互联,形成四晶粒架构。

八 | 该技术将晶粒间带宽提升至4.4TB/s以上,连接密度提升逾6倍。    M5 Ultra搭载最多36核的大尺寸中央处理器(含12颗超级核心和24颗性能核心),单线程性能较M3 Ultra提升最高达1.25倍,多线程性能提升最高达1.3倍。

九 |     

    GPU多达80核,同样内置神经网络加速器,支持最新着色器核心、第二代动态缓存、硬件加速网格着色及第三代光线追踪技术,图形性能较M3 Ultra提升最高达40%。    媒体处理引擎进一步强化,专属硬件加速H.264、HEVC、四个ProRes编解码引擎及硬件加速AV1解码一应俱全。32核神经网络引擎可在设备端以业界领先能效安全驱动复杂AI任务。    内存配置同样惊人,最高支持512GB统一内存,带宽高达1.2TB/s,较M3 Ultra提升50%,为专业创作和超大型工作负载提供充沛保障。         

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